RM2 to Participate in the AT&T LTE-M Network Pilot for the Internet of Things

RM2 International, a vertically-integrated innovator in pallet development, management, and supply, will participate in AT&T’s LTE-M network pilot that promises to boost connections for the Internet of Things (IoT).  

AT&T is working with a variety of technology leaders, to include RM2, to showcase the new LTE-M technology that will bring the IoT to a new generation of devices and markets. AT&T has launched North America’s first LTE-M enabled commercial site in the San Francisco market to support the pilot of AT&T’s LTE-M Low-Power Wide-Area network beginning later this month. AT&T plans to make the technology available across its commercial network throughout 2017.

RM2 International has developed ELIoT, a fully integrated, zero maintenance, long-life, IoT-based track and trace solution which it hopes will transform the reusable packaging industry. AT&T’s LTE-M network can support the solution through enabling up to 10 years of battery life and better wireless coverage deep inside buildings and in subterranean environments.

“Our work with RM2 during our LTE-M pilot will show how this new technology can help the packaging and supply chain industries increase their efficiency and sustain the integrity of their products,” said Chris Penrose, President, Internet of Things Solutions, AT&T. “This a prime example of how innovations like LTE-M will help bring the IoT to more endpoints than ever before.”

“Delivering to the market a first of its kind technology solution while being a part of a group that will take this offering to the next level gives RM2 a unique product offering that separates itself from other pallet service providers while guaranteeing its solution remains at the forefront of the technological evolution of the Internet of Things,” stated John Walsh, CEO of RM2.

RM2 will introduce ELIoT at the Pack Expo International and Pharma Expo in Chicago, IL from Nov. 6 – 9, 2016. RM2 will be located in the East Hall booth 6785 within the Reusable Packaging Association Pavilion.